SN74AUC1G66_09 Datasheet, PDF (2/17 Pages) Texas Instruments – SINGLE BILATERAL ANALOG SWITCH

SN74AUC1G66
SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
NanoFree™
WCSP (DSBGA) – YZP (Pb-free)
Reel of 3000
SN74AUC1G66YZPR
SON – DRY
Reel of 5000
SN74AUC1G66DRYR
SOT (SOT-23) – DBV
Reel of 3000
SN74AUC1G66DBVR
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G66DCKR
TOP-SIDE MARKING⁽³⁾
_ _ _U6_
PREVIEW
U66_
U6_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
FUNCTION TABLE
CONTROL
INPUT
(C)
L
H
SWITCH
OFF
ON
LOGIC DIAGRAM (POSITIVE LOGIC)
1
A
4
C
2
B
Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
V_I/O
Switch I/O voltage range⁽²⁾⁽³⁾
I_IK
Control input clamp current
I_IOK
I/O port diode current
I_T
On-state switch current
Continuous current through V_CC or GND
θ_JA
Package thermal impedance⁽⁴⁾
T_stg
Storage temperature range
V_I < 0
V_I/O < 0 or V_I/O > V_CC
V_I/O = 0 to V_CC
DBV package
DCK package
DRY package
YZP package
MIN
MAX
–0.5
3.6
–0.5
3.6
–0.5 V_CC + 0.5
–50
±50
±50
±100
206
252
234
123
–65
150
UNIT
V
V
V
mA
mA
mA
mA
°C/W
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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