SN74AUC1G04_10 Datasheet, PDF (2/16 Pages) Texas Instruments – SINGLE INVERTER GATE

SN74AUC1G04
SINGLE INVERTER GATE
SCES370Q – SEPTEMBER 2001 – REVISED APRIL 2007
www.ti.com
ORDERING INFORMATION
T_A
PACKAGE ^{(1) (2)}
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SON – DRY
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
Reel of 3000
Reel of 5000
Reel of 3000
Reel of 3000
Reel of 4000
ORDERABLE PART
NUMBER
SN74AUC1G04YZPR
SN74AUC1G04DRYR
SN74AUC1G04DBVR
SN74AUC1G04DCKR
SN74AUC1G04DRLR
TOP-SIDE MARKING⁽³⁾
_ _ _UC_
PREVIEW
U04_
UC_
UC_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT
A
H
L
OUTPUT
Y
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)
2
A
4
Y
Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
Voltage range applied to any output in the high-impedance or power-off state⁽²⁾
V_O
Output voltage range⁽²⁾
I_IK
Input clamp current
I_OK
Output clamp current
I_O
Continuous output current
Continuous current through V_CC or GND
V_I < 0
V_O < 0
DBV package
DCK package
θ_JA
Package thermal impedance⁽³⁾
DRL package
DRY package
YZP package
T_stg
Storage temperature range
MIN
MAX
–0.5
3.6
–0.5
3.6
–0.5
3.6
–0.5 V_CC + 0.5
–50
–50
±20
±100
206
252
142
234
132
–65
150
UNIT
V
V
V
mA
mA
mA
mA
°C/W
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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