OPA27FJ Datasheet, PDF (2/22 Pages) Texas Instruments – Ultra-Low Noise, Precision OPERATIONAL AMPLIFIERS

ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Supply Voltage ................................................................................... ±22V
Internal Power Dissipation ⁽²⁾ ....................................................... 500mW
Input Voltage ..................................................................................... ±V_CC
Output Short-Circuit Duration ⁽³⁾ ................................................. Indefinite
Differential Input Voltage ⁽⁴⁾ ............................................................. ±0.7V
Differential Input Current ⁽⁴⁾ ........................................................... ±25mA
Storage Temperature Range .......................................... –55°C to +125°C
Operating Temperature Range ......................................... –40°C to +85°C
Lead Temperature:
P (soldering, 10s) ....................................................................... +300°C
U (soldering, 3s) ......................................................................... +260°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Maximum package power dissipation versus ambient
temperature. (2) To common with ±V_CC = 15V. (4) The inputs are protected by
back-to-back diodes. Current limiting resistors are not used in order to achieve
low noise. If differential input voltage exceeds ±0.7V, the input current should
be limited to 25mA.
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
OPA27
OPA27
OPA37
OPA37
PACKAGE-LEAD
DIP-8
SO-8
DIP-8
SO-8
θ_JA
100°C/W
160°C/W
100°C/W
160°C/W
PACKAGE
DRAWING
P
D
P
D
PACKAGE
MARKING
OPA27GP
OPA27U
OPA37GP
OPA37U
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this document, or see the TI
website at www.ti.com.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATION
Top View
Offset Trim 1
–In 2
+In 3
–V_CC 4
8 Offset Trim
7 ^+VCC
6 Output
5 NC
NC = No Connection
2
OPA27, OPA37
www.ti.com
SBOS135C