OPA2348-HIREL_15 Datasheet, PDF (2/15 Pages) Texas Instruments – 1-MHz, 45-μA CMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIER

OPA2348-HiRel
SBOS482 – NOVEMBER 2009
DIE THICKNESS
10 mils.
BARE DIE INFORMATION
BACKSIDE FINISH
Silicon with backgrind
Origin
BACKSIDE POTENTIAL
V-
a
c
b
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BOND PAD
METALLIZATION COMPOSITION
Al-Si-Cu (0.5%)
d
Table 1. BOND PAD COORDINATES
DESCRIPTION
V+
Out A
-In A
+In A
Out B
-In B
+In B
V-
PAD NUMBER
1
2
3
4
5
6
7
8
a
965.6
839.4
713.2
587
383.6
257.4
131.2
5
b
c
d
5
1041.8
81.2
5
915.6
81.2
5
789.4
81.2
5
663.2
81.2
5
459.8
81.2
5
333.6
81.2
5
207.4
81.2
5
81.2
81.2
2
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