OPA1632 Datasheet, PDF (2/12 Pages) Texas Instruments – High-Perfomance, Fully-Differential AUDIO OP AMP

OPA1632
SBOS286 − DECEMBER 2003
www.ti.com
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD(1)
PACKAGE
DRAWING
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
OPA1632
SO-8
MSOP-8
PowerPAD
D
DGN
−40°C to +85°C
−40°C to +85°C
OPA1632
1632
OPA1632D
OPA1632DR
OPA1632DGN
OPA1632DGNR
(1) _{For the most current specification and package information, refer to our web site at www.ti.com.}
TRANSPORT
MEDIA, QUANTITY
Rails, 100
Tape and Reel, 2500
Rails, 100
Tape and Reel, 2500
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
over operating free-air temperature range unless otherwise noted.
Supply Voltage, ±VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16.5V
Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VS
Output Current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mA
Differential Input Voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3V
Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Operating Free-Air Temperature Range . . . . . . . . . . . . . . . −40°C to +85°C
Storage Temperature Range, TSTG . . . . . . . . . . . . . . . . . −65°C to +150°C
Lead Temperature
1,6mm (1/16th inch) from case for 10 seconds . . . . . . . . . . . . . . . . +300°C
ESD Ratings: Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
Charge Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
(1) _{Stresses above these ratings may cause permanent damage.}
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) _{The OPA1632 MSOP-8 package version incorporates a}
PowerPAD on the underside of the chip. This acts as a heatsink
and must be connected to a thermally dissipative plane for proper
power dissipation. Failure to do so may result in exceeding the
maximum junction temperature, which can permanently damage
the device. See TI technical brief SLMA002 for more information
about using the PowerPAD thermally enhanced package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN CONFIGURATION
Top View
MSOP, SO
V_IN− 1
V_OCM 2
V+ 3
V_OUT+ 4
OPA1632
8 V_IN+
7 Enable
6 V−
5 V_OUT−
2