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LMC7215_15 Datasheet, PDF (2/19 Pages) Texas Instruments – Micro-Power, Rail-to-Rail CMOS Comparators with Push-Pull/Open-Drain Outputs
LMC7215, LMC7225
SNOS882E – SEPTEMBER 1999 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)
ESD Tolerance (3)
Differential Input Voltage
Voltage at Input/Output Pin
Supply Voltage (V+–V−)
Current at Input Pin
Current at Output Pin (4)
Current at Power Supply Pin
Lead Temperature
(soldering, 10 sec)
Storage Temperature Range
Junction Temperature (5)
2 kV
V+ +0.3V, V− −0.3V
V+ +0.3V, V− −0.3V
10V
±5 mA
±30 mA
40 mA
260°C
−65°C to +150°C
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature isPD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings (1)
Supply Voltage
Temperature Range (2)
Package Thermal Resistance (θJA)
8-Pin SOIC
5-Pin SOT-23
2V ≤ VCC ≤ 8V
−40°C to +85°C
165°C/W
325°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature isPD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.
2.7V to 5V Electrical Characteristics
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 2.7V to 5V, V− = 0V, VCM = VO = V+/2. Boldface limits apply
at the temperature extremes.
Symbol
Parameter
Conditions
Typ (1)
LMC7215
Limit (2)
LMC7225
Limit (2)
Units
VOS
Input Offset Voltage
1
6
6
mV
8
8
max
TCVOS
Input Offset Voltage
Average Drift
2
μV/°C
IB
IOS
CMRR
Input Current
Input Offset Current
Common Mode
Rejection Ratio
See (3)
5
fA
1
fA
80
60
60
dB
min
(1) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(2) All limits are specified by testing or statistical analysis.
(3) CMRR measured at VCM = 0V to 2.5V and 2.5V to 5V when VS = 5V, VCM = 0.2V to 1.35V and 1.35V to 2.7V when VS = 2.7V. This
eliminates units that have large VOS at the VCM extremes and low or opposite VOS at VCM = VS/2.
2
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