LM3490IM5-12 Datasheet, PDF (2/17 Pages) Texas Instruments – LM3490 100 mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator with Logic-

LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Input Voltage (IN to GND)
Voltage ON/OFF to GND
Power Dissipation⁽³⁾
Junction Temp. (T_J)⁽³⁾
Ambient Storage Temp.
Soldering Time, Temp.⁽⁴⁾
ESD ⁽⁵⁾
Wave
Infrared
Vapor Phase
ON/OFF
All Other Pins
35V
5.5V
400 mW
+150°C
−65 to +150°C
4sec., 260°C
10sec., 240°C
75sec., 219°C
1.0kV
2.0kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (T_J - T_A)/θ_JA where T_J
is the junction temperature, T_A is the ambient temperature, and θ_JA is the junction-to-ambient thermal resistance. The 400 mW rating
results from substituting the Absolute Maximum junction temperature, 150°C, for T_J , 50°C for T_A, and 250°C/W for θ_JA. More power can
be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures. The Absolute
Maximum power dissipation can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above
50°C ambient. A θ_JA of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat
sinking enables the safe dissipation of more power. The LM3490 actively limits its junction temperature to about 150°C.
(4) Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline
packages, see http://www.ti.com.
(5) For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
OPERATING RATINGS⁽¹⁾
Maximum Input Voltage (IN to GND)
Voltage ON/OFF to GND
Junction Temperature (T_J)
Maximum Power Dissipation⁽²⁾
30V
0 to 5V
−40 to +125°C
300 mW
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature.
The 300 mW rating appearing under Operating Ratings results from substituting the maximum junction temperature for operation,
125°C, for T_J, 50°C for T_A, and 250°C/W for θ_JA in P = (T_J − T_A)/θ_JA. More power can be dissipated at lower ambient temperatures. Less
power can be dissipated at higher ambient temperatures. The maximum power dissipation for operation appearing under Operating
Ratings can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above 50°C ambient. A
θ_JA of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat sinking enables the
dissipation of more power during operation.
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