LM2936MP-5.0 Datasheet, PDF (2/28 Pages) Texas Instruments – LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator

LM2936
SNOSC48N – JUNE 2000 – REVISED MARCH 2013
Connection Diagrams
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Figure 1. PFM
Top View
See Package Number NDP0003B
Figure 2. SOT-223
Top View
See Package Number DCY0004A
Figure 3. 8-Pin SOIC (D)
Top View
See Package Number D0008A
Figure 4. 8-Pin SOIC (D)
Top View
See Package Number D0008A
Figure 5. TO-92
Bottom View
See Package Number LP0003A
Figure 6. 8-Pin VSSOP (DGK)
Top View
See Package Number DGK0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
Input Voltage (Survival)
ESD Susceptibility ⁽³⁾
Power Dissipation ⁽⁴⁾
Junction Temperature (T_Jmax)
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
+60V, −50V
2000V
Internally limited
150°C
−65°C to +150°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 100 pF discharge through a 1.5 kΩ resistor.
(4) The maximum power dissipation is a function of T_Jmax, θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_Jmax − T_A)/θ_JA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2936 will go
into thermal shutdown.
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