ADS5474_08 Datasheet, PDF (2/38 Pages) Texas Instruments – 14-Bit, 400-MSPS Analog-to-Digital Converter

ADS5474
SLAS525A – JULY 2007 – REVISED AUGUST 2008......................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT PACKAGE-LEAD
ADS5474
HTQFP-80 ⁽²⁾
PowerPAD
PACKAGE
DESIGNATOR
PFP
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
PACKAGE
MARKING
ADS5474I
ORDERING
NUMBER
ADS5474IPFP
ADS5474IPFPR
TRANSPORT
MEDIA, QUANTITY
Tray, 96
Tape and Reel, 1000
(1) For the most current product and ordering information see the Package Option Addendum located at the end of this document, or see
the TI web site at www.ti.com.
(2) Thermal pad size: 6.15 mm × 6.15 mm (minimum), 7.5 mm × 7.5 mm (maximum).
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
AVDD5 to GND
Supply voltage
AVDD3 to GND
DVDD3 to GND
Analog input to
Valid when supplies are on and within normal ranges. See additional
GND
information in the Power Supplies portion of the applications information
Clock input to GND
in the back of the datasheet regarding Clock and Analog Inputs when the
supplies are off.
CLK to CLK
Digital data output to GND
Operating temperature range
Maximum junction temperature
Storage
temperature range
ESD, human-body
model (HBM)
ADS5474
6
5
5
–0.3 to (AVDD5 + 0.3)
–0.3 to (AVDD5 + 0.3)
±2.5
–0.3 to (DVDD3 + 0.3)
–40 to +85
+150
–65 to +150
2
UNIT
V
V
V
V
V
V
V
°C
°C
°C
kV
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon
request.
THERMAL CHARACTERISTICS⁽¹⁾
PARAMETER
R_θJA ⁽²⁾
R_θJP ⁽³⁾
TEST CONDITIONS
Soldered thermal pad, no airflow
Soldered thermal pad, 150-LFM airflow
Soldered thermal pad, 250-LFM airflow
Bottom of package (thermal pad)
(1) Using 36 thermal vias (6 × 6 array). See PowerPAD Package in the Application Information section.
(2) R_θJA is the thermal resistance from the junction to ambient.
(3) R_θJP is the thermal resistance from the junction to the thermal pad.
TYP UNIT
23.7
17.8 °C/W
16.4
2.99 °C/W
2
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