THS4120 Datasheet, PDF (19/23 Pages) Texas Instruments – HIGH-SPEED FULLY DIFFERENTIAL I/O AMPLIFIERS

THERMAL PAD MECHANICAL DATA
www.ti.com
DGN (S-PDSO-G8)
THERMAL INFORMATION
This PowerPAD™ package incorporates an exposed thermal pad that is designed to be attached directly to an
external heatsink. When the thermal pad is soldered directly to the printed circuit board (PCB), the PCB can be
used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a
ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from
the integrated circuit (IC).
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,
refer to Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
and Application Brief, PowerPAD Made Easy , Texas Instruments Literature No. SLMA004. Both documents are
available at www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.
8
5
1,73
MAX
Exposed Thermal Pad
1
4
1,78
MAX
NOTE: All linear dimensions are in millimeters
Top View
Exposed Thermal Pad Dimensions
PowerPAD is a trademark of Texas Instruments
PPTD041