TAS5112A_15 Datasheet, PDF (19/30 Pages) Texas Instruments – DIGITAL AMPLIFIER POWER STAGE

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Copper Layer − Component Side
Solder
PowerPAD
TAS5112ACDA
TAS5112A
SLES094B - OCTOBER 2003 - REVISED JUNE 2008
5y11 Vias (f 0.3 mm)
8 mm
Figure 14. Recommended Land Pattern
The lower via pad area, slightly larger than the IC pad itself,
is exposed with a window in the solder resist on the bottom
surface of the board. It is not coated with solder during the
board construction to maintain a flat surface. In production,
this can be accomplished with a peelable solder mask.
An aluminum bar is used to keep the through-hole leads
from shorting to the chassis. The thermal compound
shown has a pad-to-aluminum bar thermal resistance of
about 3.2°C/W.
The chassis provides the only heatsink to air and is chosen
as representative of a typical production cooling approach.
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