TPS799 Datasheet, PDF (18/39 Pages) Texas Instruments – TPS799 200-mA, Low-Quiescent Current, Ultralow Noise, High-PSRR Low-Dropout LinearRegulator

TPS799
SBVS056K – JANUARY 2005 – REVISED JANUARY 2015
11 Device and Documentation Support
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11.1 Device Support
11.1.1 Development Support
11.1.1.1 Evaluation Modules
An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS799.
This EVM, the TPS799 evaluation module, can be requested at the Texas Instruments web site through the
product folders or purchased directly from the TI eStore.
11.1.1.2 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of
analog circuits and systems. A SPICE model for the TPS799 is available through the product folders under
simulation models.
11.1.2 Device Nomenclature
Table 1. Device Nomenclature⁽¹⁾
PRODUCT
TPS799xx(x) yyy z
V_OUT
xx(x) is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).
yyy is package designator.
z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
• Application report: Using New Thermal Metrics, SBVA025.
• Application report: IC Package Thermal Metrics, SPRA953
• TPS799xxEVM-105 User's Guide, SLVU130
11.3 Trademarks
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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