TPS62080_15 Datasheet, PDF (18/27 Pages) Texas Instruments – TPS6208x 1.2-A High-Efficiency, Step-Down Converter With DCS-Control™ and Snooze Mode

TPS62080, TPS62080A, TPS62081, TPS62082
SLVSAE8E – SEPTEMBER 2011 – REVISED APRIL 2015
www.ti.com
10 Power Supply Recommendations
The device is designed to operate from an input supply voltage range between 2.3 V and 6 V. Ensure that the
input power supply has a sufficient current rating for the application.
11 Layout
11.1 Layout Guidelines
The PCB layout is an important step to maintain the high performance of the TPS6208x devices.
The input/output capacitors and the inductor should be placed as close as possible to the IC. This keeps the
traces short. Routing these traces direct and wide results in low trace resistance and low parasitic inductance. A
common power GND should be used. The low-side of the input and output capacitors must be connected
properly to the power GND to avoid a GND potential shift.
The sense traces connected to the FB and VOS pins are signal traces. Special care should be taken to avoid
noise being induced. By a direct routing, parasitic inductance can be kept small. GND layers might be used for
shielding. Keep these traces away from SW nodes.
11.2 Layout Example
L1
VIN
C1
C2 ^VOUT
GND
GND
R1
R2
Figure 31. PCB Layout Suggestion
11.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering Exposed Thermal Pad
• Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics of
Linear and Logic Packages Using JEDEC PCB Designs (SZZA017) and Semiconductor and IC Package Thermal
Metrics (SPRA953).
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