TPA0212 Datasheet, PDF (18/33 Pages) Texas Instruments – STEREO 2-W AUDIO POWER AMPLIFIER WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL

TPA0212
STEREO 2-W AUDIO POWER AMPLIFIER
WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL
SLOS284 – NOVEMBER 1999
THERMAL INFORMATION
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 41)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Figure 41. Views of Thermally Enhanced PWP Package
APPLICATION INFORMATION
selection of components
Figure 42 and Figure 43 are schematic diagrams of typical notebook computer application circuits.
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