TLC7226C_07 Datasheet, PDF (18/25 Pages) Texas Instruments – QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTERS

www.ti.com
PACKAGE OPTION ADDENDUM
14-Aug-2007
PACKAGING INFORMATION
Orderable Device
5962-87802012A
5962-87802012C
TLC7226CDW
TLC7226CDWG4
TLC7226CDWR
TLC7226CDWRG4
TLC7226CN
TLC7226CNE4
TLC7226IDW
TLC7226IDWG4
TLC7226IDWR
TLC7226IDWRG4
TLC7226IN
TLC7226INE4
TLC7226MFKB
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
LCCC
LCCC
SOIC
Package
Drawing
FK
FK
DW
SOIC
DW
SOIC
DW
SOIC
DW
PDIP
N
PDIP
N
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
PDIP
N
PDIP
N
LCCC
FK
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20
1
TBD
POST-PLATE N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20 20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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