OPA141_1 Datasheet, PDF(18/25 Page) Texas Instruments – Single-Supply, 10MHz, Rail-to-Rail Output,Low-Noise, JFET Amplifier

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OPA141_1 Datasheet, PDF (18/25 Pages) Texas Instruments – Single-Supply, 10MHz, Rail-to-Rail Output,Low-Noise, JFET Amplifier

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PACKAGE OPTION ADDENDUM

www.ti.com

1-May-2010

PACKAGING INFORMATION

Orderable Device

OPA141AID

OPA141AIDGKR

OPA141AIDGKT

OPA141AIDR

OPA2141AID

OPA2141AIDGKR

OPA2141AIDGKT

OPA2141AIDR

OPA4141AID

OPA4141AIDR

OPA4141AIPW

OPA4141AIPWR

Status (1)

PREVIEW

Package

Type

SOIC

MSOP

SOIC

MSOP

SOIC

TSSOP

Package

Drawing

DGK

Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

Qty

TBD

Call TI

8 2500

TBD

Call TI

8 250

TBD

Call TI

8 2500

TBD

Call TI

TBD

Call TI

8 2500

TBD

Call TI

8 250

TBD

Call TI

8 2500

TBD

Call TI

14 50

TBD

Call TI

14 2500

TBD

Call TI

14 90

TBD

Call TI

14 2000

TBD

Call TI

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

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