LM3485MM Datasheet, PDF (18/23 Pages) Texas Instruments – Hysteretic PFET Buck Controller

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM3485MM
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE VSSOP
DGK 8 1000
Eco Plan
(2)
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-40 to 125
LM3485MM/NOPB
LM3485MMX
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
DGK 8 3500
TBD
CU SN
Call TI
Level-1-260C-UNLIM -40 to 125
Call TI
-40 to 125
LM3485MMX/NOPB
LM3485Q1MM/NOPB
LM3485Q1MMX/NOPB
ACTIVE
ACTIVE
ACTIVE
VSSOP
VSSOP
VSSOP
DGK 8 3500 Green (RoHS
& no Sb/Br)
DGK 8 1000 Green (RoHS
& no Sb/Br)
DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
S29B
S29B
S29B
S29B
SVJB
SVJB
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a}
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Samples
Addendum-Page 1