AM5716_15 Datasheet, PDF (172/389 Pages) Texas Instruments – AM571x SitaraTM Processors

AM5716, AM5718
SPRS919I – JUNE 2014 – REVISED OCTOBER 2015
www.ti.com
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC
package.
Table 5-19. Thermal Resistance Characteristics
NO. PARAMETER
DESCRIPTION
°C/W⁽¹⁾
AIR FLOW (m/s)⁽²⁾
T1 RΘ_JC
T2 RΘ_JB
T3
Junction-to-case
Junction-to-board
Junction-to-free air
0.41
N/A
4.74
N/A
11.9
0
T4
T5
RΘ_JA
Junction-to-moving air
8.9
1
8.0
2
T6
7.4
3
T7
0.22
0
T8
T9
Ψ_JT
Junction-to-package top
0.22
1
0.22
2
T10
0.23
3
T11
4.12
0
T12
T13 ^ΨJB
Junction-to-board
3.73
1
3.59
2
T14
3.48
3
(1) These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘ_JC] measurement,
which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more
information, see these EIA/JEDEC standards:
– JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
– JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
– JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
– JESD51-9, Test Boards for Area Array Surface Mount Packages
(2) m/s = meters per second
172 Specifications
Copyright © 2014–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AM5716 AM5718