PCF8575C Datasheet, PDF (17/26 Pages) NXP Semiconductors – Remote 16-bit I/O expander for I2C-bus

www.ti.com
PACKAGE OPTION ADDENDUM
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
PCF8575CDB
PCF8575CDBE4
PCF8575CDBQR
PCF8575CDBQRE4
PCF8575CDBQRG4
PCF8575CDBR
PCF8575CDBRE4
PCF8575CDGVR
PCF8575CDGVRE4
PCF8575CDW
PCF8575CDWE4
PCF8575CDWR
PCF8575CDWRE4
PCF8575CPW
PCF8575CPWE4
PCF8575CPWR
PCF8575CPWRE4
PCF8575CRGER
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP
Package
Drawing
DB
SSOP
DB
SSOP/
QSOP
SSOP/
QSOP
SSOP/
QSOP
SSOP
DBQ
DBQ
DBQ
DB
SSOP
DB
TVSOP
DGV
TVSOP
DGV
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
QFN
RGE
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 3000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1