OPA1641_1004 Datasheet, PDF (17/22 Pages) Texas Instruments – High-Performance, JFET-Input AUDIO OPERATIONAL AMPLIFIERS

PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2010
PACKAGING INFORMATION
Orderable Device
OPA1641AID
OPA1641AIDR
OPA1642AID
OPA1642AIDGKR
OPA1642AIDGKT
OPA1642AIDR
OPA1644AID
OPA1644AIDR
OPA1644AIPW
OPA1644AIPWR
Status ⁽¹⁾
ACTIVE
Package
Type
SOIC
Package
Drawing
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE MSOP
DGK
ACTIVE MSOP
DGK
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
PREVIEW TSSOP
PW
PREVIEW TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
14 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
14 90
TBD
Call TI
Call TI
14 2000
TBD
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
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