HD3SS3212_15 Datasheet, PDF (17/25 Pages) Texas Instruments – HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

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HD3SS3212, HD3SS3212I
SLASE74A – MAY 2015 – REVISED AUGUST 2015
11 Power Supply Recommendations
The HD3SS3212 does not require a power supply sequence. However, TI recommends that OEn is asserted low
after device supply V_CC is stable and in specification. TI also recommends to place ample decoupling capacitors
at the device V_CC near the pin.
12 Layout
12.1 Layout Guidelines
On a high-K board, TI always recommends to solder the PowerPAD™ onto the thermal land. A thermal land is
the area of solder-tinned-copper underneath the PowerPAD package. On a high-K board, the HD3SS3212 can
operate over the full temperature range by soldering the PowerPAD onto the thermal land without vias.
On a low-K board, for the device to operate across the temperature range, the designer must use a 1-oz Cu
trace connecting the GND pins to the thermal land. A general PCB design guide for PowerPAD packages is
provided in PowerPAD Thermally-Enhanced Package, SLMA002.
12.2 Layout Example
Figure 16. HD3SS3212 Basic Layout Example for Application Shown
in Down Facing Port for USB3.1 Type C
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Product Folder Links: HD3SS3212 HD3SS3212I