TPS54227DRCT Datasheet, PDF (16/26 Pages) Texas Instruments – 4.5V to 18V Input, 2-A SYNCHRONOUS STEP DOWN CONVERTER

PACKAGE OPTION ADDENDUM
www.ti.com
14-Jul-2013
PACKAGING INFORMATION
Orderable Device
TPS54227DDA
TPS54227DDAR
TPS54227DRCR
TPS54227DRCT
Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
(1)
Drawing
Qty
(2)
(3)
ACTIVE SO PowerPAD DDA 8
75 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE SO PowerPAD DDA
8 2500 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SON
DRC 10 3000 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
ACTIVE
SON
DRC 10
250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85
& no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
54227
54227
54227
54227
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
(5) _{Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation}
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Samples
Addendum-Page 1