TPA6203A1_07 Datasheet, PDF (16/27 Pages) Texas Instruments – 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

TPA6203A1
SLOS364E – MARCH 2002 – REVISED DECEMBER 2005
www.ti.com
8-Pin QFN (DRB) Layout
Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste
should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the
package.
0.7 mm
1.4 mm
0.33 mm plugged vias (5 places)
0.38 mm
0.65 mm
1.95 mm
Solder Mask: 1.4 mm x 1.85 mm centered in package
Make solder paste a hatch pattern to fill 50%
3.3 mm
Figure 35. TPA6203A1 8-Pin QFN (DRB) Board Layout (Top View)
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