TLC556 Datasheet, PDF (16/18 Pages) Texas Instruments – DUAL LinCMOSE TIMERS

www.ti.com
PACKAGE OPTION ADDENDUM
11-Mar-2005
PACKAGING INFORMATION
Orderable Device
5962-89503022A
5962-8950302CA
TLC556CD
TLC556CDG4
TLC556CDR
TLC556CDRG4
TLC556CN
TLC556CNE4
TLC556ID
TLC556IDR
TLC556IN
TLC556INE4
TLC556MD
TLC556MDR
TLC556MFKB
TLC556MJ
TLC556MJB
TLC556MN
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
Package
Type
LCCC
CDIP
SOIC
Package
Drawing
FK
J
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
LCCC
FK
ACTIVE
CDIP
J
ACTIVE
CDIP
J
OBSOLETE PDIP
N
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20
1
None
POST-PLATE Level-NC-NC-NC
14
1
None
A42 SNPB Level-NC-NC-NC
14 50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 25
Pb-Free
(RoHS)
CU NIPD Level-NC-NC-NC
14 25
None
Call TI
Call TI
14 50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
14 25
Pb-Free
(RoHS)
CU NIPD Level-NC-NC-NC
14 25
None
Call TI
Call TI
14 50
None
CU NIPDAU Level-1-220C-UNLIM
14
1
None
CU NIPDAU Level-1-220C-UNLIM
20
1
None
POST-PLATE Level-NC-NC-NC
14
1
None
A42 SNPB Level-NC-NC-NC
14
1
None
A42 SNPB Level-NC-NC-NC
14
None
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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