THS6182_08 Datasheet, PDF (16/35 Pages) Texas Instruments – LOW-POWER DISSIPATION ADSL LINE DRIVER

THS6182
SLLS544H – SEPTEMBER 2002 – REVISED JUNE 2007
APPLICATION INFORMATION
www.ti.com
The THS6182 contains two independent operational amplifiers. These amplifiers are current feedback topology
amplifiers made for high-speed operation. They have been specifically designed to deliver the full power
requirements of ADSL and therefore can deliver output currents of at least 400 mA at full output voltage.
The THS6182 is fabricated using Texas Instruments 30-V complementary bipolar process, HVBiCOM. This
process provides excellent isolation and high slew rates that result in the device's excellent crosstalk and
extremely low distortion.
DEVICE PROTECTION FEATURE
The THS6182 has a built-in thermal protection feature. Should the internal junction temperature rise above
approximately 160°C, the device automatically shuts down. Such a condition could exist with improper heat
sinking or if the output is shorted to ground. When the abnormal condition is fixed, the internal thermal shutdown
circuit automatically turns the device back on. This occurs at approximately 145°C, junction temperature. Note
that the THS6182 does not have short-circuit protection and care should be taken to minimize the output current
below the absolute maximum ratings.
THERMAL INFORMATION
The THS6182 is available in a thermally-enhanced DWP and RHF package, which is a member of the
PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is
mounted [see Figure 69(a) and Figure 69(b), for the DWP package example]. This arrangement results in the
lead frame being exposed as a thermal pad on the underside of the package [see Figure 69(c)]. Because this
thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing
a good thermal path away from the thermal pad. Note that the PowerPAD is electronically isolated from the
active circuitry and any pins. Thus, the PowerPAD can be connected to any potential voltage within the absolute
maximum voltage range. Ideally, connection of the PAD to the ground plane is preferred as the plane typically is
the largest copper plane on a PCB.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerations section of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
A. The thermal pad is electrically isolated from all terminals in the package.
Figure 69. Views of Thermally Enhanced DWP Package
16
Submit Documentation Feedback