LP2966IMMX-3325 Datasheet, PDF (16/21 Pages) Texas Instruments – Dual 150mA Ultra Low-Dropout Regulator

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
LP2966IMM-1833/NOPB
LP2966IMM-2518/NOPB
LP2966IMM-2525
LP2966IMM-2525/NOPB
LP2966IMM-2828/NOPB
LP2966IMM-3325
LP2966IMM-3325/NOPB
LP2966IMM-5050/NOPB
LP2966IMMX-1833/NOPB
LP2966IMMX-2518/NOPB
LP2966IMMX-3325
LP2966IMMX-3325/NOPB
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
NRND
VSSOP
DGK 8 1000
TBD
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
NRND
VSSOP
DGK 8 1000
TBD
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
ACTIVE VSSOP
DGK 8 1000 Green (RoHS
& no Sb/Br)
ACTIVE VSSOP
DGK 8 3500 Green (RoHS
& no Sb/Br)
ACTIVE VSSOP
DGK 8 3500 Green (RoHS
& no Sb/Br)
NRND
VSSOP
DGK 8 3500
TBD
ACTIVE VSSOP
DGK 8 3500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU SN
CU SN
Call TI
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
-40 to 125
-40 to 125
Level-1-260C-UNLIM -40 to 125
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
LCFB
LJKB
LAAB
LAAB
LABB
LARB
LARB
LAFB
LCFB
LJKB
LARB
LARB
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples