BUF01900 Datasheet, PDF (16/25 Pages) Texas Instruments – Programmable Voltage Source with Memory

BUF01900
BUF01901
SBOS337A − OCTOBER 2006 − REVISED OCTOBER 2006
PROGRAMMABLE POWER SUPPLY
The BUF0190x integrated buffer amplifier can drive large
capacitive loads (see Typical Characteristics) and greater
than 100mA of output current, making it well-suited for pro-
grammable power supplies.
Note that the BUF01900 integrated buffer has an input
range that only extends to about 0.8V above GND; there-
fore, the programmable power supply is not able to output
voltages less than approximately 0.8V.
3.3V
15V
10kΩ
10kΩ
µC
BUF01900
(1)
Load
+
100µF
www.ti.com
QFN/DFN THERMALLY-ENHANCED
PACKAGE
The BUF0190x uses the 10-lead DFN package, a thin,
thermally-enhanced package designed to eliminate the
use of bulky heat sinks and slugs traditionally used in ther-
mal packages. The DFN package can be easily mounted
using standard printed circuit board (PCB) assembly tech-
niques. See QFN/SON PCB Attachment Application Note
(SLUA271) available at www.ti.com.
The thermal resistance junction to ambient (R_qJA) of the
DFN package depends on the PCB layout. Using thermal
vias and wide PCB traces improves thermal resistance.
The thermal pad must be soldered to the PCB. The thermal
pad on the bottom of the package should be connected to
GND.
Soldering the exposed thermal pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests. Even
with applications that have low-power dissipation, the ex-
posed pad must be soldered to the PCB to provide struc-
tural integrity and long-term reliability.
NOTE: (1) Optional −see Typical Characteristic curves
Figure 10 through Figure 14 for load regulation
performance.
Figure 24. Programmable Power Supply
16