CD4051B_10 Datasheet, PDF (15/25 Pages) Texas Instruments – CMOS Analog Multiplexers/Demultiplexers with Logic Level Conversion

PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2010
Orderable Device
CD4053BM96
CD4053BM96E4
CD4053BM96G3
CD4053BM96G4
CD4053BME4
CD4053BMG4
CD4053BMT
CD4053BMTE4
CD4053BMTG4
CD4053BNSR
CD4053BNSRE4
CD4053BNSRG4
CD4053BPW
CD4053BPWE4
CD4053BPWG4
CD4053BPWR
CD4053BPWRE4
CD4053BPWRG3
CD4053BPWRG4
Status ⁽¹⁾ Package Package
Type Drawing
ACTIVE
SOIC
D
ACTIVE
SOIC
D
PREVIEW SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SO
NS
ACTIVE
SO
NS
ACTIVE
SO
NS
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
PREVIEW TSSOP
PW
ACTIVE TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500
TBD
Call TI
Call TI
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000
TBD
Call TI
Call TI
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 3