BQ24314_1 Datasheet, PDF (15/25 Pages) Texas Instruments – OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li+ CHARGER FRONT-END PROTECTION IC

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bq24314
bq24316
SLUS763C – JULY 2007 – REVISED OCTOBER 2007
PCB Layout Guidelines:
• This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages.
Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of
PCB traces satisfy the design rules for high voltages.
• The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD should
be thermally coupled with the PCB ground plane. In most applications, this will require a copper pad directly
under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.
• C_IN and C_OUT should be located close to the IC. Other components like R_ILIM and R_BAT should also be located
close to the IC.
Copyright © 2007, Texas Instruments Incorporated
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