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OPA356_07 Datasheet, PDF (14/19 Pages) Texas Instruments – 200MHz, CMOS OPERATIONAL AMPLIFIER
www.ti.com
PACKAGE OPTION ADDENDUM
7-May-2007
PACKAGING INFORMATION
Orderable Device
OPA2356AID
OPA2356AIDG4
OPA2356AIDGKR
OPA2356AIDGKRG4
OPA2356AIDGKT
OPA2356AIDGKTG4
OPA2356AIDR
OPA2356AIDRG4
OPA356AID
OPA356AIDBVR
OPA356AIDBVRG4
OPA356AIDBVT
OPA356AIDBVTG4
OPA356AIDG4
OPA356AIDR
OPA356AIDRG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
Package
Drawing
D
SOIC
D
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
SOIC
D
SOIC
D
SOIC
D
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOIC
D
SOIC
D
SOIC
D
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
8 100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1