THS3122 Datasheet, PDF (13/20 Pages) Texas Instruments – LOW-NOISE, HIGH-SPEED, 450 mA CURRENT FEEDBACK AMPLIFIERS

PWP (R-PDSO-G**)
20-PIN SHOWN
0,65
20
1
A
THS3122
THS3125
SLOS382 − SEPTEMBER 2001
MECHANICAL INFORMATION
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,19
11
0,10 M
Thermal Pad
(See Note D)
4,50 6,60
4,30 6,20
0,15 NOM
Gage Plane
10
0°−ā 8°
0,25
0,75
0,50
1,20 MAX
Seating Plane
0,15
0,10
0,05
PINS **
14
16
20
24
28
DIM
A MAX
5,10
5,10
6,60
7,90
9,80
A MIN
4,90
4,90
6,40
7,70
9,60
4073225/E 03/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
www.ti.com
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