TLV716_15 Datasheet, PDF (12/21 Pages) Texas Instruments – Capacitor-Free, Dual, 150-mA, Low-Dropout Voltage Regulator (LDO) in 1,2-mm × 1,2-mm SON Package

TLV716
TLV716P
SBVS217A – JUNE 2013 – REVISED SEPTEMBER 2013
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POWER DISSIPATION
The ability to remove heat from a die is different for each package type, presenting different considerations in the
printed circuit board (PCB) layout. The copper PCB area around the device that is free of other components
moves the heat from the device to ambient air. Performance data for JEDEC-low and high-K boards are given in
the Thermal Information table. Using heavier copper increases effectiveness in removing heat from the device.
Power dissipation (P_D) is equal to the product of the output current and the voltage drop across both output pass
elements, as shown in Equation 1:
P_D = (V_IN – V_OUT1) × I_OUT1 + (V_IN – V_OUT2) × I_OUT2
(1)
The maximum ambient temperature that the device can operate within the maximum T_J operating temperature of
+125°C depends on the thermal impedance and the total power dissipated within the device. Figure 25 and
Figure 26 show maximum ambient temperature verses output current for two different LDO configurations.
Figure 25 shows the maximum ambient temperature with V_IN = 3.3 V, V_OUT1 = 1.8 V, and V_OUT2 = 1.0 V versus
I_OUT1. Figure 26 shows the maximum ambient temperature with V_IN = 5.0 V, V_OUT1 = 3.3 V, and V_OUT2 = 1.8 V
versus I_OUT1.
125
115
105
95
85
75
65
55
45
35
25
0
5 Vin, 3.3 Vout1, 1.8
Vout2, Iout2 = 0 mA
5 Vin, 3.3 Vout1, 1.8
Vout2, Iout2 = 75 mA
30
60
90
I_OUT1 (mA)
120
150
C014
Figure 25. Maximum Ambient Temperature vs Output Current
(V_IN = 5.0 V, V_OUT1 = 3.3 V, V_OUT2 = 1.8 V)
125
115
105
95
85
75
65
55
45
35
25
0
3.3 Vin, 1.8 Vout1, 1.0
Vout2, Iout2 = 0 mA
3.3 Vin, 1.8 Vout1, 1.0
Vout2, Iout2 = 75 mA
30
60
90
I_OUT1 (mA)
120
150
C014
Figure 26. Maximum Ambient Temperature vs Output Current
(V_IN = 3.3 V, V_OUT1 = 1.8 V, V_OUT2 = 1.0 V)
12
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