TIBPAL22V10-10C Datasheet, PDF (12/17 Pages) Texas Instruments – HIGH-PERFORMANCE IMPACT-X E PROGRAMMABLE ARRAY LOGIC CIRCUITS

TIBPAL22V10-10C
HIGH-PERFORMANCE IMPACT-X ™ PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS015 – D3972, FEBRUARY 1992
THERMAL INFORMATION
thermal management of the TIBPAL22V10-10C
Thermal management of the TIBPAL22V10-10CNT and TIBPAL22V10-10CFN is necessary when operating at
certain conditions of frequency, output loading, and outputs switching simultaneously. The device and system
application will determine the appropriate level of management.
Determining the level of thermal management is based on factors such as power dissipation (P_D), ambient
temperature (T_A), and transverse airflow (FPM). Figures 4 (a) and 4 (b) show the relationship between ambient
temperature and transverse airflow at given power dissipation levels. The required transverse airflow can be
determined at a particular ambient temperature and device power dissipation level in order to ensure the device
specifications.
Figure 5 illustrates how power dissipation varies as a function of frequency and the number of outputs switching
simultaneously. It should be noted that all outputs are fully loaded (C_L = 50 pF). Since the condition of eight fully
loaded outputs represents the worst-case condition, each application must be evaluated accordingly.
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
600
600
500
500
400
400
300
PD = 1.6 W
200
PD = 1.4 W
PD = 1.2 W
PD = 1 W
100
300
PD = 1.6 W
200
PD = 1.4 W
PD = 1.2 W
PD = 1 W
100
0
0 10 20 30 40 50 60 70 80
TA – Ambient Temperature – °C
(a) TIBPAL22V10-10CNT
Figure 4
0
0 10 20 30 40 50 60 70 80
TA – Ambient Temperature – °C
(b) TIBPAL22V10-10CFN
12
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