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OPA353 Datasheet, PDF (12/13 Pages) Burr-Brown (TI) – High-Speed, Single-Supply, Rail-to-Rail OPERATIONAL AMPLIFIERS MicroAmplifier ™ Series
www.ti.com
PACKAGE OPTION ADDENDUM
9-Mar-2005
PACKAGING INFORMATION
Orderable Device
OPA2353EA/250
OPA2353EA/2K5
OPA2353UA
OPA2353UA/2K5
OPA353NA/250
OPA353NA/3K
OPA353UA
OPA353UA/2K5
OPA4353EA/250
OPA4353EA/250G4
OPA4353EA/2K5
OPA4353UA
OPA4353UA/2K5
OPA4353UA/2K5G4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
MSOP
MSOP
SOIC
SOIC
SOT-23
SOT-23
SOIC
SOIC
SSOP/
QSOP
SSOP/
QSOP
SSOP/
QSOP
SOIC
SOIC
SOIC
Package
Drawing
DGK
DGK
D
D
DBV
DBV
D
D
DBQ
DBQ
DBQ
D
D
D
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
8 250
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
8 100
None
CU
Level-3-220C-168 HR
8 2500
None
CU
Level-3-220C-168 HR
5 250
None
CU NIPDAU Level-3-220C-168 HR
5 3000
None
CU NIPDAU Level-3-220C-168 HR
8 100
None
CU
Level-3-220C-168 HR
8 2500
None
CU
Level-3-220C-168 HR
16 250
None
CU NIPDAU Level-3-260C-168 HR
16 250
None
Call TI
Call TI
16 2500
None
CU NIPDAU Level-3-260C-168 HR
14 58
14 2500
14 2500
None
None
None
CU SNPB
CU SNPB
Call TI
Level-3-220C-168 HR
Level-3-220C-168 HR
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1