ISO721 Datasheet, PDF (12/22 Pages) Texas Instruments – 3.3-V / 5-V HIGH-SPEED DIGITAL ISOLATORS

ISO721, ISO721M
ISO722, ISO722M
SLLS629B – JANUARY 2006 – REVISED MAY 2006
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IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply, and without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system
failures.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
I_S
Safety input, output, or supply current
θ_JA = 263°C/W, V_I = 5.5 V, T_J = 170°C, T_A = 25°C
θ_JA = 263°C/W, V_I = 3.6 V, T_J = 170°C, T_A = 25°C
100
153
T_S Maximum case temperature
150
UNIT
mA
°C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The junction-to-air thermal resistance in the Thermal
Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test
Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input
voltage times the current. The junction temperature is then the ambient temperature plus the power times the
junction-to-air thermal resistance.
THERMAL CHARACTERISTICS
(over recommended operating conditions unless otherwise noted)
PARAMETER
θ_JA Junction-to-Air
θ_JB
Junction-to-Board Thermal
Resistance
θ_JC
Junction-to-Case Thermal
Resistance
P_D
Device Power Dissipation
TEST CONDITIONS
Low-K Thermal Resistance⁽¹⁾
High-K Thermal Resistance⁽¹⁾
ISO72x
V_CC1 = V_CC2 = 5.5 V, T_J = 150°C,
C_L = 15 pF, Input a 100 Mbps 50% duty
cycle square wave
V_CC1 = V_CC2 = 5.5 V, T_J = 150°C,
ISO72xM C_L = 15 pF, Input a 150 Mbps 50% duty
cycle square wave
MIN
TYP MAX UNIT
263
°C/W
125
°C/W
44
°C/W
75
°C/W
159
mW
195
(1) Tested in accordance with the Low-K or High-K thermal metric definition of EIA/JESD51-3 for leaded surface mount packages.
200
175
150
125
V_CC1 = 5.5 V,
V_CC2 = 5.5 V
100
V_CC1 = 3.6 V,
V_CC2 = 3.6 V
75
50
25
0
0
50
100
150
200
Case Temperature − ^oC
Figure 7. θ_JC THERMAL DERATING CURVE per IEC 60747-5-2
12
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