GD65232 Datasheet, PDF (12/18 Pages) Texas Instruments – MULTIPLE RS-232 DRIVERS AND RECEIVERS

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PACKAGE OPTION ADDENDUM
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
GD65232DBR
GD65232DW
GD65232DWR
GD65232N
GD65232PW
GD65232PWR
GD75232DB
GD75232DBR
GD75232DW
GD75232DWR
GD75232N
GD75232PW
GD75232PWR
Status ⁽¹⁾
ACTIVE
Package
Type
SSOP
Package
Drawing
DB
ACTIVE
SOIC
DW
ACTIVE
SOIC
DW
ACTIVE
PDIP
N
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
OBSOLETE SSOP
DB
ACTIVE
SSOP
DB
ACTIVE
SOIC
DW
ACTIVE
SOIC
DW
ACTIVE
PDIP
N
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
Pins Package Eco Plan ⁽²⁾
Qty
20 2000
Pb-Free
(RoHS)
20 25
Pb-Free
(RoHS)
20 2000
Pb-Free
(RoHS)
20 20
Pb-Free
(RoHS)
20 70
Pb-Free
(RoHS)
20 2000
Pb-Free
(RoHS)
20
Pb-Free
(RoHS)
20 2000
Pb-Free
(RoHS)
20 25
Pb-Free
(RoHS)
20 2000
Pb-Free
(RoHS)
20 20
Pb-Free
(RoHS)
20 70
Pb-Free
(RoHS)
20 2000
Pb-Free
(RoHS)
Lead/Ball Finish MSL Peak Temp ⁽³⁾
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1