OPA347NA Datasheet, PDF (11/33 Pages) Texas Instruments – microPower, Rail-to-Rail Operational Amplifiers

OPA2347 WCSP PACKAGE
The OPA2347YED and OPA2347YZDR are die-level pack-
ages using bump-on-pad technology. The OPA2347YED de-
vice has tin-lead balls; the OPA2347YZDR has lead-free
balls. Unlike devices that are in plastic packages, these
devices have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly procedures,
the WCSP can be mounted to a printed circuit board without
additional under fill. Figures 10 and 11 detail pinout and
package marking.
OPA2347YED
Top View
Actual Size:
Exact Size:
1.008mm x 2.100mm
Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347YED
A9 = indicates OPA2347YZD
S = for engineering purposes only
(bump side down)
FIGURE 11. Top View Package Marking.
OPA2347
(bump side down)
Not to Scale
Out A 1
–In A 2
+In A 3
V– 4
8 V+
7 Out B
6 –In B
5 +In B
WCSP-8
(top view)
FIGURE 10. Pin Description.
PHOTOSENSITIVITY
Although the OPA2347YED/YZD package has a protective
backside coating that reduces the amount of light exposure
on the die, unless fully shielded, ambient light will still reach
the active region of the device. Input bias current for the
OPA2347YED/YZD package is specified in the absence of
light. Depending on the amount of light exposure in a given
application, an increase in bias current, and possible in-
creases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED and OPA2347YZDR
devices have been verified to successfully pass a series of
reliability stress tests. A summary of JEDEC standard reli-
ability tests is shown in Table I.
TEST
Temperature Cycle
CONDITION
–40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp⁽¹⁾
10 Minute Dwell
Drop
50cm
Key Push
100 Cycles/min,
1300 µε, Displacement = 2.7mm Max
3 Point Bend
Strain Rate 5 mm/min, 85 mm Span
NOTE: (1) Per IPC9701.
TABLE I. Reliability Test Results.
ACCEPT CRITERIA (ACTUAL)
500 (1600) Cycles, R < 1.2X from R₀
10 (129) Drops, R < 1.2X from R₀
5K (6.23K) Cycles, R < 1.2X from R₀
R < 1.2X from R₀
SAMPLE SIZE
36
8
8
8
OPA347, 2347, 4347
11
SBOS167D
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