OPA347 Datasheet, PDF (11/21 Pages) Texas Instruments – microPower, Rail-to-Rail Operational Amplifiers

OPA2347 WCSP PACKAGE
The OPA2347YED is a die-level package using bump-on-pad
technology. Unlike plastic packages, the OPA2347YED has no
molding compound, lead frame, wire bonds, or leads. Using
standard surface-mount assembly procedures, the WCSP can
be mounted to a printed circuit board without additional under
fill. Figures 10 and 11 detail pinout and package marking.
OPA2347
(bump side down)
Not to Scale
Out A 1
–In A 2
+In A 3
V– 4
8 V+
7 Out B
6 –In B
5 +In B
WCSP-8
(top view)
FIGURE 10. Pin Description.
OPA2347YED
Top View
Actual Size:
Exact Size:
1.008mm x 2.100mm
Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347
S = for engineering purposes only
(bump side down)
FIGURE 11. Top View Package Marking.
PHOTOSENSITIVITY
Although the OPA2347YED package has a protective back-
side coating that reduces the amount of light exposure on the
die, unless fully shielded, ambient light will still reach the
active region of the device. Input bias current for the
OPA2347YED package is specified in the absence of light.
Depending on the amount of light exposure in a given
application, an increase in bias current, and possible in-
creases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
PACKAGE DIMENSIONS
The OPA2347YED is transported in tape and reel media and
is described in Table I and Figure 12. Pin 1 orientation is
consistent throughout the tape and reel carrier, with balls
facing down in each pocket of the carrier tape. The location
of Pin 1 is specified in Figure 12.
DIMENSIONS (mm)
Pocket Width, A₀
Pocket Length, B₀
Pocket Depth, K₀
Pocket Pitch, P₁
Sprocket Hole-to-Pocket Centerline, F
Sprocket Hole-to-Pocket Offset, P₂
Sprocket Hole Pitch, P₀
Tape Width, W
Reel Diameter, Max
TABLE I. Carrier Tape Dimensions.
OPA2347YED
1.12 ± 0.10
2.13 ± 0.10
0.61 ± 0.10
4.00 ± 0.10
3.50 ± 0.05
2.00 ± 0.05
4.00 ± 0.10
8.00 ± 0.30
TBD
0.229
Y
P₂
1.50 ± 0.10
P₀
1.75 ± 0.10
E₁
Pin 1^{(1) +}
+
+
+
+
+
+ _B0
FW
C_L
++++++
5°
Y
P₁
K_O
Section Y – Y Dimensions in mm
NOTE: (1) Pin 1 location is
A_{0 in the upper left-hand corner}
of the cavity. Units are shipped
with bumps down.
FIGURE 12. Tape and Reel Carrier Tape Diagram.
LAND PATTERNS AND ASSEMBLY
The recommended land pattern for the OPA2347YED package
is detailed in Figure 13 with specifications listed in Table III.
The maximum amount of force during assembly should be
limited to 30 grams of force per bump.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED has been verified to
successfully pass a series of reliability stress tests. A sum-
mary of JEDEC standard reliability tests is shown in Table II.
TEST
Temperature Cycle
CONDITION
–40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp⁽¹⁾
10 Minute Dwell
Drop
50cm
Key Push
100 Cycles/min,
1300 µε, Displacement = 2.7mm Max
3 Point Bend
Strain Rate 5 mm/min, 85 mm Span
NOTE: (1) Per IPC9701.
TABLE II. Reliability Test Results.
ACCEPT CRITERIA (ACTUAL)
500 (1600) Cycles, R < 1.2X from R₀
10 (129) Drops, R < 1.2X from R₀
5K (6.23K) Cycles, R < 1.2X from R₀
R < 1.2X from R₀
SAMPLE SIZE
36
8
8
8
OPA347, 2347, 4347
11
SBOS167C
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