TAS5754M_15 Datasheet, PDF (109/127 Pages) Texas Instruments – Digital Input, Closed-Loop Class-D Amplifier with HybridFlow Processing

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TAS5754M
SLAS987 – JUNE 2014
Layout Guidelines (continued)
However, the thermal pad on the PCB is quite large and depositing a large, single deposition of solder paste
would lead to manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the
solder paste to outgas during the assembly process and reduce the risk of solder bridging under the device. This
structure is called an aperture array, and is shown in the Layout Examples section. It is important that the total
area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the
area of the thermal pad itself.
11.2 Layout Examples
11.2.1 2.0 (Stereo BTL) System
Figure 86. 2.0 (Stereo BTL) 3-D View
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