SN74CB3T16211_07 Datasheet, PDF (10/15 Pages) Texas Instruments – 24-BIT FET SWITCH 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V-TOLERANT LEVEL SHIFTER

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PACKAGE OPTION ADDENDUM
24-May-2007
PACKAGING INFORMATION
Orderable Device
74CB3T16211DGGRE4
74CB3T16211DGVRE4
74CB3T16211DGVRG4
74CB3T16211DLRG4
SN74CB3T16211DGG
SN74CB3T16211DGGR
SN74CB3T16211DGVR
SN74CB3T16211DL
SN74CB3T16211DLG4
SN74CB3T16211DLR
SN74CB3T16211GQLR
SN74CB3T16211ZQLR
Status ⁽¹⁾
ACTIVE
Package
Type
TSSOP
Package
Drawing
DGG
ACTIVE TVSOP
DGV
ACTIVE TVSOP
DGV
ACTIVE
SSOP
DL
PREVIEW TSSOP
DGG
ACTIVE TSSOP
DGG
ACTIVE TVSOP
DGV
ACTIVE
SSOP
DL
ACTIVE
SSOP
DL
ACTIVE
SSOP
DL
NRND
ACTIVE
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
GQL
ZQL
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
56 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 35 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
56 1000
TBD
SNPB
Level-1-240C-UNLIM
56 1000 Green (RoHS & SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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