CD54HC173 Datasheet, PDF (10/17 Pages) Texas Instruments – High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State

www.ti.com
PACKAGE OPTION ADDENDUM
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
5962-8682501EA
5962-8875901EA
CD54HC173F
CD54HC173F3A
CD54HCT173F3A
CD74HC173E
CD74HC173M
CD74HC173M96
CD74HC173MT
CD74HC173NSR
CD74HC173PW
CD74HC173PWR
CD74HC173PWT
CD74HCT173E
CD74HCT173M
CD74HCT173M96
CD74HCT173MT
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
Package
Drawing
J
J
J
J
J
N
SOIC
D
SOIC
D
SOIC
D
SO
NS
TSSOP
PW
TSSOP
PW
TSSOP
PW
PDIP
N
SOIC
D
SOIC
D
SOIC
D
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16 40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 90
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 250
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16 40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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