WL1271-TIWI Datasheet, PDF (1/2 Pages) Texas Instruments – WLAN 802.11 b/g/n and Bluetooth® v2.1 + EDR Module

WL1271-TiWi
www.ti.com
SWRS100A – JANUARY 2011 – REVISED MARCH 2011
WLAN 802.11 b/g/n and Bluetooth® v2.1 + EDR Module
FEATURES
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•2345 IEEE 802.11 b/g/n Compliant
• Typical WLAN Transmit power:
– +20dBm, 11Mbps, CCK (b)
– +14.5dBm, 54Mbps, OFDM (g)
– +12.5dBm, 65Mbps, OFDM (n)
• Typical WLAN Receiver sensitivity:
– –89dBm, 8% PER, 11Mbps
– –76dBm, 10% PER, 54Mbps
– –73dBm, 10% PER, 65Mbps
• Bluetooth v2.1 + Enhanced Data Rate (EDR)
• Increased Bluetooth Transmit Power:
+9.5dBm Typical
• -92dBm typical Bluetooth^® Receiver Sensitivity
• Best-In-Class WLAN and Bluetooth
Coexistence Technology on a Single-Chip
• Enhanced Low Power (ELP™) Technology for
Extended Battery Life
• On Board TCXO, Power Regulation and U.FL
Antenna Connector
• Hardware and Software Pre-integration With
TI's AM/DM37x (ARM Cortex™-A8), AM18xx
(ARM9), and OMAP4™ (ARM Cortex™-A9)
Platforms
• Software Upgradable for ANT and Bluetooth
Low Energy
• Dimensions: 13mm x 18mm x 1.9mm
• FCC/IC/CE Certified
• Operating Temperature Range: –40°C to 85°C
APPLICATIONS
• Consumer Devices
• Industrial and Home Automation
• Point of Sale and Point of Purchase
• Video Conferencing, Video Camera and VoIP
• Medical Devices
• Security and Surveillance
DESCRIPTION
The following product brief applies to LS Research’s
WLAN + Bluetooth module, series name: TiWi. The
WLAN + Bluetooth chip used is the WL1271 from
Texas Instruments.
The WL1271-TiWi is a fully-integrated high
performance module offered by LS Research using
TI’s single-chip WL1271 2.4GHz IEEE 802.11 b/g/n
and Bluetooth v2.1 + Enhanced Data Rate (EDR)
Transceiver. Based on TI’s 6th generation WLAN
technology and 7th generation Bluetooth technology,
the solution provides best-in-class coexistence
capabilities coupled with TI’s Enhanced Low Power
(ELP) technology. The WL1271-TiWi is provided as a
module to help customers reduce development time,
lower manufacturing costs, save board space, ease
certification, and minimize RF expertise required. For
evaluation and development, various platforms are
available which integrate the WL1271-TiWi module,
Linux WLAN drivers, BlueZ Bluetooth stack, and
sample source applications running on a TI host
processor (AM/DM37x, AM18x, OMAP4).
The full specification and purchasing of the
WL1271-TiWi module can be found on LSR's website
(www.lsr.com/tiwi). More information on TI’s wireless
platform solutions can be found on the Wireless
Connectivity Wiki (www.ti.com/connectivitywiki).
Disclaimer:
All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of
any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of
the third party products or services referenced on this product brief. This information is provided subject to TI’s
Terms of Use.
Be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OMAP4 is a trademark of Texas Instruments.
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Cortex is a trademark of ARM.
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Bluetooth is a registered trademark of Bluetooth SIG, Inc.
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All other trademarks are the property of their respective owners.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated