TXS02612 Datasheet, PDF (1/22 Pages) Texas Instruments – SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION

TXS02612
www.ti.com ............................................................................................................................................................... SCES682A – MAY 2008 – REVISED JULY 2008
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION
FEATURES
1
•2 6-to-12 Demultiplexer/Multiplexer Allows SDIO
Port Expansion
• Built-in Level Translator Eliminates Voltage
Mismatch Between Baseband and SD Card or
SDIO Peripheral
• V_CCA, V_CCB0, and V_CCB1 Each Operate Over Full
1.1-V to 3.6-V Range
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance A Port
– 2000-V Human-Body Model (A114-B)
– 100-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
• ESD Performance B Port
– ±6-kV IEC 61000-4-2 ESD,
Air-Gap Discharge
– ±8-kV IEC 61000-4-2 ESD,
Contact Discharge
DESCRIPTION/ORDERING INFORMATION
The TXS02612 is designed to interface the cellphone baseband with external SDIO peripherals. The device
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if
required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is
selected; when SEL = High, B1 port is selected. SEL is referenced to V_CCA. For the unselected B port, the clock
output is held low, whereas the data and command I/Os are pulled high to their respective V_CCB through a 70-kΩ
resistor (±30% tolerance).
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
MicroStar Junior™ BGA
(VFBGA) – ZQS
Reel of 3000
TXS02612ZQSR
QFN – RTW
Reel of 3000
TXS02612RTWR
TOP-SIDE MARKING
YJ612
YJ612
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
RTW PACKAGE
(TOP VIEW)
ZQS PACKAGE
(TOP VIEW)
12345
24 23 22 21 20 19
A
DAT2A 1
GND 2
DAT3A 3
CMDA 4
Exposed
Center Pad
18 DAT0_B0 ^B
17 VCC_B1
C
16 DAT1_B0 ^D
15 DAT1_B1 ^E
V_CCA 5
14 DAT0_B1
DAT0A 6
13 CLK_B1 For RTW, if the exposed
7 8 9 10 11 12
center pad is used, it must
be connected to ground
or electrically open.
ZQS PACKAGE TERMINAL ASSIGNMENTS
1
2
3
4
5
A
DAT2A SEL DAT3_B0 CMD_B0 CLK_B0
B
DAT3A
DAT2_B0 V_CCB0 DAT0_B0
C
CMDA
V_CCA
GND
V_CCB1 DAT1_B0
D
DAT0A CLKA
GND
DAT1_B1 DAT0_B1
E
DAT1A DAT2_B1 DAT3_B1 CMD_B1 CLK_B1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated