TXB0101_08 Datasheet, PDF (1/22 Pages) Texas Instruments – 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION

TXB0101
www.ti.com........................................................................................................................................... SCES639A – JANUARY 2007 – REVISED NOVEMBER 2008
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION
FEATURES
1
•2 Available in the Texas Instruments NanoFree™
Package
• 1.2 V to 3.6 V on A Port and
1.65 V to 5.5 V on B Port (V_CCA ≤ V_CCB)
• V_CC Isolation Feature – If Either V_CC Input Is at
GND, All Outputs Are in the High-Impedance
State
• OE Input Circuit Referenced to V_CCA
• Low Power Consumption, 5-µA Max I_CC
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2000-V Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 15-kV Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
V_CCA
1
6
GND
2
5
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
V_CCB
V_CCA
GND
1
2
6
V_CCB V_CCA ¹
6 V_CCB
5
OE ^{GND 2}
5 OE
OE
A
3
4B
A3 4B
YZP PACKAGE
(BOTTOM VIEW)
A B ^{C1 3 4 C2}
GND ^{B1 2 5 B2} OE
V V _CCA A1 1 6 A2
CCB
A
3
4
B
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track V_CCA. V_CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V_CCB. V_CCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V_CCA should not exceed V_CCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated