TS5A3167_15 Datasheet, PDF (1/27 Pages) Texas Instruments – 0.9-Ω SPST ANALOG SWITCH

TS5A3167
www.ti.com
SCDS187A – FEBRUARY 2005 – REVISED OCTOBER 2012
0.9-Ω SPST ANALOG SWITCH
Check for Samples: TS5A3167
FEATURES
1
• Isolation in Powered-Off Mode, V₊ = 0
• Low ON-State Resistance (0.9 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio and Video Signal Routing
• Low-Voltage Data-Acquisition Systems
• Communication Circuits
• Modems
• Hard Drives
• Computer Peripherals
• Wireless Terminals and Peripherals
• Microphone Switching – Notebook Docking
SOT-23 OR SC-70 PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
NC 1
COM 2
GND 3
5 V₊ GND ₃
4 IN
COM 2
NC 1
4 IN
5 V₊
DESCRIPTION/ORDERING INFORMATION
The TS5A3167 is a single-pole single-throw (SPST) analog switch that is designed to operate from
1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion
(THD) performance and consumes very low power. These features make this device suitable for portable audio
applications.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
TS5A3167YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Tape and reel
free)
TS5A3167YZPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Tape and reel
free)
TS5A3167YZPRB ⁽³⁾
SOT (SOT-23) – DBV
Tape and reel
TS5A3167DBVR
SOT (SC-70) – DCK
Tape and reel
TS5A3167DCKR
TOP-SIDE MARKING⁽²⁾
PACKAGE PREVIEW
JG_
JG_
JAT_
JG_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
(3) **YZPRB is for backside coating
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2012, Texas Instruments Incorporated