TS5A3160 Datasheet, PDF (1/24 Pages) Texas Instruments – 1-ohm SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER

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TS5A3160
1-Ω SPDT ANALOG SWITCH
5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
SCDS216 – OCTOBER 2005
FEATURES
• Isolation in the Powered-Off Mode, V₊ = 0
• Specified Make-Before-Break Switching
• Low ON-State Resistance (1 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Excellent ON-State Resistance Matching
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio and Video Signal Routing
• Low-Voltage Data Acquisition Systems
• Communication Circuits
• Modems
• Hard Drives
• Computer Peripherals
• Wireless Terminals and Peripherals
DBV OR DCK PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
NO 1
GND 2
NC 3
6 _IN
5 V₊
4 _COM
NC 3
GND ²
NO 1
4 COM
5 _V+
6 _IN
DESCRIPTION/ORDERING INFORMATION
The TS5A3160 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance
matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power.
These features make this device suitable for portable audio applications.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
–40°C to 85°C ^{0.23-mm Large Bump – YZP}
(Pb-free)
ORDERABLE PART NUMBER
TS5A3160YEPR
Tape and reel
TS5A3160YZPR
SOT (SOT-23) – DBV
SOT (SC-70) – DCK⁽²⁾
Tape and reel TS5A3160DBVR
Tape and reel TS5A3160DCKR
TOP-SIDE MARKING⁽²⁾
PREVIEW
JA8_
JA_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated