TS5A3153_09 Datasheet, PDF (1/26 Pages) Texas Instruments – 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER

TS5A3153
www.ti.com ..................................................................................................................................................... SCDS215A – OCTOBER 2005 – REVISED JULY 2008
5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
FEATURES
1
•2 Isolation in the Powered-Off Mode, V₊ = 0
• Specified Break-Before-Make Switching
• Low ON-State Resistance (1 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Excellent ON-State Resistance Matching
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DCU PACKAGE
(TOP VIEW)
COM 1
EN 2
GND 3
GND 4
Logic
Control
8 V₊
7 NC
6 NO
5 IN
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio and Video Signal Routing
• Low-Voltage Data-Acquisition Systems
• Communication Circuits
• Modems
• Hard Drives
• Computer Peripherals
• Wireless Terminals and Peripherals
YZP PACKAGE
(BOTTOM VIEW)
GND
Logic
D14 _Control
5 D2
IN
GND C13
6 ^C2 NO
EN ^B12
COM ^{A1 1}
7 ^B2 NC
8 A2 _V+
DESCRIPTION/ORDERING INFORMATION
The TS5A3153 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers a low ON-state resistance and an excellent on-resistance matching with the
break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to
another. The device has an excellent total harmonic distortion (THD) performance and consumes very low
power. These features make this device suitable for portable audio applications.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000 TS5A3153YZPR
SSOP – DCU
Reel of 3000 TS5A3153DCUR
TOP-SIDE MARKING⁽³⁾
_ _ _J57
JCD_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2008, Texas Instruments Incorporated