TS5A23167 Datasheet, PDF (1/25 Pages) Texas Instruments – 0.9-W DUAL SPST ANALOG SWITCH 5-V/3.3-V 2-CHANNEL ANALOG SWITCH

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FEATURES
• Isolation in Powered-Off Mode, V₊ = 0
• Low ON-State Resistance (0.9 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
SSOP OR VSSOP PACKAGE
(TOP VIEW)
NC1 1
COM1 2
IN2 3
GND 4
8 V₊
7 IN1
6 COM2
5 NC2
TS5A23167
0.9-Ω DUAL SPST ANALOG SWITCH
5-V/3.3-V 2-CHANNEL ANALOG SWITCH
SCDS195 – MAY 2005
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio and Video Signal Routing
• Low-Voltage Data Acquisition Systems
• Communication Circuits
• Modems
• Hard Drives
• Computer Peripherals
• Wireless Terminals and Peripherals
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4
IN2 ₃
COM1 2
NC1 1
5 NC2
6 ^COM2
7 IN1
8 V+
DESCRIPTION/ORDERING INFORMATION
The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD)
performance and consumes very low power. These features make this device suitable for portable audio
applications.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
TS5A23167YEPR
PACKAGE PREVIEW
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Tape and reel
TS5A23167YZPR
PACKAGE PREVIEW
SSOP – DCT
Tape and reel
TS5A23167DCTR
PACKAGE PREVIEW
VSSOP – DCU (Pb-free)
Tape and reel
TS5A23167DCUR
JAP_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The acutal top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated