TS5A23166 Datasheet, PDF (1/22 Pages) Texas Instruments – 0.9-ohm DUAL SPST ANALOG SWITCH 5-V/3.3-V 2-CHANNEL ANALOG SWITCH

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FEATURES
• Isolation in Powered-Down Mode, V₊ = 0
• Low ON-State Resistance (0.9 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Excellent ON-State Resistance Matching
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
SSOP OR VSSOP PACKAGE
(TOP VIEW)
NO1 1
COM1 2
IN2 3
GND 4
8 V₊
7 IN1
6 COM2
5 NO2
TS5A23166
0.9-Ω DUAL SPST ANALOG SWITCH
5-V/3.3-V 2-CHANNEL ANALOG SWITCH
SCDS196 – MAY 2005
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio and Video Signal Routing
• Low-Voltage Data-Acquisition Systems
• Communication Circuits
• Modems
• Hard Drives
• Computer Peripherals
• Wireless Terminals and Peripherals
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4
IN2 ₃
COM1 2
NO1 ₁
5 NO2
6 COM2
7 IN1
8 V₊
DESCRIPTION/ORDERING INFORMATION
The TS5A23166 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance
matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power.
These features make this device suitable for portable audio applications.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
–40°C to 85°C ^{0.23-mm Large Bump – YZP}
(Pb-free)
ORDERABLE PART NUMBER
TS5A23166YEPR
Tape and reel
TS5A23166YZPR
SSOP – DCT
Tape and reel TS5A23166DCTR
VSSOP – DCU (Pb-free)
Tape and reel TS5A23166DCUR
TOP-SIDE MARKING⁽²⁾
PACKAGE PREVIEW
PACKAGE PREVIEW
PACKAGE PREVIEW
JAM_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated