TS5A22366 Datasheet, PDF (1/21 Pages) Texas Instruments – 0.7-Ω DUAL SPDT ANALOG SWITCH WITH NEGATIVE RAIL CAPABILITY AND 1.8-V COMPATIBLE INPUT LOGIC

TS5A22366
www.ti.com ................................................................................................................................................ SCDS262A – JANUARY 2009 – REVISED AUGUST 2009
0.7-Ω DUAL SPDT ANALOG SWITCH
WITH NEGATIVE RAIL CAPABILITY AND 1.8-V COMPATIBLE INPUT LOGIC
FEATURES
1
• Negative Signaling Capability: Maximum
Swing From –2.75 V to 2.75 V (V₊ = 2.75 V)
• Low ON-State Resistance (0.7 Ω Typ)
• Excellent ON-State Resistance Matching
• 1.8-V Compatible Control Input Threshold
Independent of V₊
• Control Inputs Are 5.5-V Tolerant
• 2.25-V to 5.5-V Power Supply (V₊)
• Low Charge Injection
• Specified Break-Before-Make Switching
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
YFC PACKAGE
D
C
B
A
32 1
Laser Marking View
D
C
B
A
12 3
Bump View
• ESD Performance Tested Per JESD 22
– 2500-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 200-V Machine Model (A115-A)
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Audio Routing
• Portable Media Players
YFC PACKAGE TERMINAL ASSIGNMENTS
D
NC1
V₊
NC2
C
COM1
GND
COM2
B
NO1
GND
NO2
A
IN1
N.C. ⁽¹⁾
IN2
1
2
3
(1) N.C. –No internal connection
DESCRIPTION/ORDERING INFORMATION
The TS5A22366 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V
to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the
switch without distortion.
The break-before-make feature prevents signal distortion during the transferring of a signal from one path to
another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total
harmonic distortion (THD) performance are ideal for audio applications.
The TS5A22366 is available is a ultra small 1.6 mm × 1.2 mm wafer-chip-scale package (WCSP) (0.4 mm pitch)
and in a 2 mm × 1.5 mm quad flat (QFN) package (0.5 mm pitch).
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
YFC (Pb-free)
Tape and reel
TS5A22366YFCR
TOP-SIDE MARKING⁽³⁾
3A_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) YFC: The actual top-side marking has one additional character to designate the assembly/test site. Pin 1 identifier indicates solder-bump
composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated